[c-nsp] T1 Bonding with PA-MC-T3

[Troy Beisigl]

Hi Nick,

The PA-MC-T3 card works fine for MLPPP in the 7206. We are using them here
with no problem. 


interface Multilink4
 description Dual Circuit to TRI-CITY MC
 ip address 172.20.1.69 255.255.255.252
 ip nat inside
 no cdp enable
 ppp multilink
 multilink max-links 2
 multilink min-links 1
 no ppp multilink fragmentation
 multilink-group 4
!
interface Serial5/0/9:0
 description Circuit SD/HCGS/080703 to TRI-CITY MC on S0
 ip address 172.30.1.13 255.255.255.252
 encapsulation ppp
 down-when-looped
 ppp multilink
 multilink-group 4
!
interface Serial5/0/11:0
 description Circuit SD/HCGS/080704 to TRI-CITY MC on S1
 ip address 172.30.1.21 255.255.255.252
 encapsulation ppp
 down-when-looped
 ppp multilink
 multilink-group 4
!

Troy Beisigl

-----Original Message-----
From: cisco-nsp-bounces at puck.nether.net
[mailto:cisco-nsp-bounces at puck.nether.net] On Behalf Of Nick Voth
Sent: Friday, March 14, 2008 3:11 PM
To: cisco-nsp at puck.nether.net
Subject: [c-nsp] T1 Bonding with PA-MC-T3

Guys,

I have a 7206 VXR with a PA-MC-T3 card in it for doing T1's off of a
channelized DS3. I know the PA-MC-T3 doesn't support MLPPP bonding of
multiple T1's. The problem is, my NPE doesn't support the newer PA-MC-T3-EC
enhanced card that works for T1 bonding.

I know I could feed the DS3 to some separate Mux and pull individual T1's
off of that and bond them in a different Cisco card. Problem is, that's not
really a very "clean" solution for us and definitely adds some other links
in the chain that could fail.

SO, is there any way to accomplish T1 bonding with that existing DS3 card or
am I just stuck?

Thanks very much for any help.

-Nick Voth


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