[c-nsp] Bonded T1 Circuits

[Bill Buhlman]

MLPPP
working config below. Do the same thing on the remote router ie:create multilink interface with IP address and add DS1 interfaces to multilink group
 
interface Multilink1
 description Orinda bundle DS3 channels 11,18,12
 ip address xxx.xxx.x.177 255.255.255.252
 ip flow ingress
 ppp multilink
 multilink-group 1
 service-policy output MLPPP-4.6
 
interface Serial1/0/0/11:0
 description Orinda #1 Circuit ID xxxx-001PT
 no ip address
 encapsulation ppp
 ppp multilink
 multilink-group 1
!
interface Serial1/0/0/12:0
 description Link to Orinda #3 CID xxx-001PT
 no ip address
 encapsulation ppp
 ppp multilink
 multilink-group 1
interface Serial1/0/0/18:0

 description Orinda USD #2 Circuit ID xxx-001PT
 no ip address
 encapsulation ppp
 ppp multilink
 multilink-group 1

--- On Tue, 10/20/09, Dominic <dominic at broadconnect.ca> wrote:


From: Dominic <dominic at broadconnect.ca>
Subject: [c-nsp] Bonded T1 Circuits
To: cisco-nsp at puck.nether.net
Date: Tuesday, October 20, 2009, 8:05 AM


Hi Everyone:

Two questions:

1. I need to bond two T1 circuits. Does anyone have a working sample config? The POP end is a 7206VXR with NPE-G2 and the PA-MC-2T3-EC Card, and the customer end is a Cisco 1841.
2. Also need to bond as many as 4 T1s.  Would that be pushing it, and what would generally be the cleanest way to do it?


Dominic 

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